发明名称 METHOD OF MANUFACTURING CONDUCTIVE BONDING MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To improve conductivity and durability of bonding strength of a conductive bonding material for bonding an SOFC electrode with an inter-connector. <P>SOLUTION: A method of manufacturing the conductive bonding material includes steps of: obtaining slurry containing NiO, Fe<SB>2</SB>O<SB>3</SB>and TiO<SB>2</SB>; obtaining a sintered compact by heat-treating the slurry at 1200-1400&deg;C; obtaining particles having particle sizes of 0.5-10 &mu;m by shuttering the sintered compact; and kneading the particles while adding an additive and a vehicle to the particles. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005158268(A) 申请公布日期 2005.06.16
申请号 JP20030390382 申请日期 2003.11.20
申请人 MITSUBISHI HEAVY IND LTD 发明人 MORI KAZUTAKA;OGAWA AKIRA;TAKENOBU KOICHI;MATANO YASUHIRO
分类号 H01M8/02;H01M8/12 主分类号 H01M8/02
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