发明名称 WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board on which a high frequency signal can be efficiently propagated to wiring conductors for signals and an electronic part to be mounted can be normally operated. <P>SOLUTION: In the wiring board provided with insulating layers 1b, a plurality of grounding or power supply conductor layers 4bp, 4cp formed on one main surface of the insulating layers 1b and a plurality of signal wiring conductors 4ap formed on the other main surface of the insulating layer 1b so as to be opposed to the grounding or power supply conductor layers 4bp, 4cp, each of the signal wiring conductors 4ap is formed so as not to be spread over two or more grounding or power supply conductor layers 4bp, 4cp. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005159091(A) 申请公布日期 2005.06.16
申请号 JP20030396932 申请日期 2003.11.27
申请人 KYOCERA CORP 发明人 OKAZAKI AYUMI
分类号 H01L23/12 主分类号 H01L23/12
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