| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a holder which easily handle an object when holding the object such as a circuit board by an adhesiveness. <P>SOLUTION: The method for manufacturing a holder, which holds the circuit board in which an adhesive material for bonding electronic components is printed through a screen mask by a squeegee, has a stage for mounting the adhesive material on the main body of the holder, a stage for heating a metal mold having a plurality of hole parts each bottom face of which is flat or convex shaped, and pressing the metal mold against the adhesive material, and guiding the adhesive material to the bottom face, and a stage for separating the metal mold from the adhesive material after cooling the metal mold. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
