| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain a wiring board having through holes in which an etching resist layer is formed in predetermined pattern by immersing an insulating substrate into photosensitive resist liquid and then pulling it up thereby coating the entire surface of the insulating substrate including the inner wall face of the through holes and vias with a photosensitive resist liquid layer. <P>SOLUTION: An insulating substrate having a metal conductor layer formed on the inner wall face of through holes and vias and on the opposite surfaces of a substrate is immersed into photosensitive resist liquid and then pulled up so that the metal conductor layer is covered with an etching resist layer and then a circuit is formed by etching. In such a method for manufacturing a wiring board having through holes and vias, viscosity of photosensitive resist liquid for forming the etching resist layer is set in the range of 20-200 mPas, surface tension is set at 30 mN/m or less, and thixotropy value is set in the range of 1.0-3.0. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
