发明名称 DEPOSITING METHOD, FILM, ELECTRONIC DEVICE AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide a depositing method forming a film with uniform film thickness, the film formed of the depositing method, an electronic device having the film, and electronic equipment. SOLUTION: The depositing method has a process for forming a mask 6 on a base material 5, a process for supplying a liquid material 7 for forming the film in an opening part 61 of the mask 6, a process for performing first heat treatment on the liquid material 7 and half-solidifying it, a process for removing the mask 6, a process for swelling a half-solidified liquid material 8', and a process for performing second heat treatment on the half-solidified liquid material 8'. Thus, the film 8 whose face on a side opposite to the base material 5 is flattened can be obtained by removing the mask 6 prior to solidification of the liquid material 7. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005158824(A) 申请公布日期 2005.06.16
申请号 JP20030391460 申请日期 2003.11.20
申请人 SEIKO EPSON CORP 发明人 MIYAGAWA TAKUYA
分类号 G02F1/1333;G02F1/1368;H01L21/283;H01L21/288;H01L21/312;H01L21/316;H01L21/3205;H01L21/336;H01L21/768;H01L29/786;H01L51/50;H05B33/10;H05B33/14;(IPC1-7):H01L21/288;G02F1/136;H01L21/320;G02F1/133 主分类号 G02F1/1333
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