PRESSURE SENSITIVE ADHESIVE TAPE FOR DICING

摘要

PROBLEM TO BE SOLVED: To provide a pressure sensitive adhesive tape for dicing that can solve defects of causing improper adhesion and improper IC products in a semiconductor device assembling process for ICs or the like, because many low molecular weight substances such as an epoxy resin are included in adhesive components in a pressure sensitive adhesive agent in a conventional pressure sensitive adhesive tape, and the adhesive components are softened at dicing resulting in producing many whisker-like cutting trashes. SOLUTION: The pressure sensitive adhesive tape for dicing disclosed herein is formed with a pressure sensitive adhesive layer having adhesion on a base film, the elastic modulus of the pressure sensitive adhesive layer is 1×105Pa or over at 25°C and the elastic modulus of the pressure sensitive adhesive layer is 1×104Pa or over at 80°C. COPYRIGHT: (C)2005,JPO&NCIPI