发明名称 WIRING BOARD, SEMICONDUCTOR DEVICE, AND THEIR MANUFACTURING METHODS
摘要 PROBLEM TO BE SOLVED: To provide a technique by which fine wiring can be formed in forming a pattern of wiring etc., by discharging droplets. SOLUTION: In forming a pattern by the droplet discharging method (also called as the ink-jet method), a coating film of a porous material (including a poromeric material) is formed as the base of the pattern. A wiring board has a porous film and a conductive layer formed on the porous film. A semiconductor device has a thin film transistor using the above-mentioned conductive layer as a gate electrode. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005159324(A) 申请公布日期 2005.06.16
申请号 JP20040310286 申请日期 2004.10.26
申请人 SEMICONDUCTOR ENERGY LAB CO LTD 发明人 MAEKAWA SHINJI;ARAI YASUYUKI
分类号 H01L21/288;H01L21/3205;H01L21/336;H01L29/417;H01L29/786;(IPC1-7):H01L21/320 主分类号 H01L21/288
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