发明名称 |
WIRING BOARD, SEMICONDUCTOR DEVICE, AND THEIR MANUFACTURING METHODS |
摘要 |
PROBLEM TO BE SOLVED: To provide a technique by which fine wiring can be formed in forming a pattern of wiring etc., by discharging droplets. SOLUTION: In forming a pattern by the droplet discharging method (also called as the ink-jet method), a coating film of a porous material (including a poromeric material) is formed as the base of the pattern. A wiring board has a porous film and a conductive layer formed on the porous film. A semiconductor device has a thin film transistor using the above-mentioned conductive layer as a gate electrode. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005159324(A) |
申请公布日期 |
2005.06.16 |
申请号 |
JP20040310286 |
申请日期 |
2004.10.26 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
MAEKAWA SHINJI;ARAI YASUYUKI |
分类号 |
H01L21/288;H01L21/3205;H01L21/336;H01L29/417;H01L29/786;(IPC1-7):H01L21/320 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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