| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat treatment apparatus wherein a substrate can be heat-treated by improving the in-plane temperature uniformity of the substrate. SOLUTION: The heat treatment apparatus comprises a heating plate 51' wherein the substrate W is arranged adjacently or mounted and heat-treated; a ceiling plate 63' which is arranged facing the substrate arranging surface of the heating plate 51' and having a temperature control mechanism 80; a surrounding member 62' for surrounding a space between the heating plate 51' and the ceiling plate 63'; a gas supply nozzle 102 which is arranged at one side of the heating plate 51' and for introducing gas into the space; and an exhaust nozzle 107 which is arranged at the other side of the heating plate 51' and for exhausting the gas from the space S'. The gas is supplied from one side of the heating plate 51' to the other side by the gas supply nozzle 102, the gas is exhausted by the exhaust nozzle 107, and an air stream of one direction is formed. COPYRIGHT: (C)2005,JPO&NCIPI
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