| 摘要 |
PROBLEM TO BE SOLVED: To provide a deposition method, surely preventing a deposition liquid from wrapping around. SOLUTION: This deposition method for forming a film on a substrate having a through hole includes a first applying process of applying a first liquid for deposition to a second surface on the opposite side to a first surface of the substrate with a heating member for heating the substrate in contact with the surface surface of the substrate. In the first applying process, the first liquid is sprayed to the second surface. The quantity of the first liquid applied in the first applying process is 0.0001 to 0.1 mL/cm<SP>2</SP>. The heating temperature of the heating member is 50 to 400°C. The surface of the heating member coming into contact with the substrate is a substantially flat surface. The method includes a first drying process of drying the first liquid applied to the second surface. A film formed on the second surface is a liquid repellent film. The method includes a second applying process of forming a film on the second surface, facing the first surface down, and applying a second liquid for deposition on the first surface by a pressure control type slit coater. COPYRIGHT: (C)2005,JPO&NCIPI
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