发明名称 RESIN COMPOSITION AND RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To provide a resin composition of which the hydrolysis and the heat discoloration are reduced and a resin composition of which the hydrolysis and the heat discoloration of the content are reduced. SOLUTION: The resin composition includes a resin and a layered organosilicate in which a substituted silyl group having a substituted or an unsubstituted alkyl group is bound to a layered polysilicate. The resin molding is obtained by molding a resin composition containing a layered organosilicate in which the substituted silyl group having a substituted or an unsubstituted alkyl group is bound to the layered polysilicate. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005154553(A) 申请公布日期 2005.06.16
申请号 JP20030394176 申请日期 2003.11.25
申请人 SHISEIDO CO LTD;UNITIKA LTD 发明人 TAKAHASHI TAKASHI;TAKADA MOTOKI
分类号 C08L101/00;C08K9/04;C08K9/06;C08L101/16;(IPC1-7):C08L101/00 主分类号 C08L101/00
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