发明名称 |
RESIN COMPOSITION AND RESIN MOLDING |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition of which the hydrolysis and the heat discoloration are reduced and a resin composition of which the hydrolysis and the heat discoloration of the content are reduced. SOLUTION: The resin composition includes a resin and a layered organosilicate in which a substituted silyl group having a substituted or an unsubstituted alkyl group is bound to a layered polysilicate. The resin molding is obtained by molding a resin composition containing a layered organosilicate in which the substituted silyl group having a substituted or an unsubstituted alkyl group is bound to the layered polysilicate. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005154553(A) |
申请公布日期 |
2005.06.16 |
申请号 |
JP20030394176 |
申请日期 |
2003.11.25 |
申请人 |
SHISEIDO CO LTD;UNITIKA LTD |
发明人 |
TAKAHASHI TAKASHI;TAKADA MOTOKI |
分类号 |
C08L101/00;C08K9/04;C08K9/06;C08L101/16;(IPC1-7):C08L101/00 |
主分类号 |
C08L101/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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