发明名称 Recessed gate structure with reduced current leakage and overlap capacitance
摘要 A gate structure and method for forming the same the method including providing a silicon substrate including one of N and P-well doped regions and an overlying the CVD silicon oxide layer; forming an opening in the CVD silicon oxide layer to include a recessed area extending into a thickness portion of the silicon substrate; thermally growing a gate oxide over exposed silicon substrate portions of the recessed area; backfilling the opening with polysilicon; planarizing the polysilicon to the opening level to reveal the silicon oxide layer; and, selectively removing the silicon oxide layer to form a recessed gate structure.
申请公布号 US2005127433(A1) 申请公布日期 2005.06.16
申请号 US20030728967 申请日期 2003.12.04
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 LIN DA-WEN;SHEU YI-MING;LEUNG YING-KEUNG
分类号 H01L21/336;H01L29/423;H01L29/76;H01L29/78;(IPC1-7):H01L29/76 主分类号 H01L21/336
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