摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide resin paste which is soluble to nitrogen-free polar solvents and, has a cold-setting property and screen-printability and is excellent in PCT (pressure cooker test) resistance, heat resistance, electrical characteristics, low warpage, flexibility, adhesion to a sealant, solvent resistance, chemical resistance, workability and economical efficiency, and a film-formed material which is excellent in these characteristics using the same. SOLUTION: The polyimide resin paste contains (A) 100 pts.wt. polyimide resin composition comprising a polyimide resin having a repeating unit represented by formula (I) (wherein Rs are each independently a 1-18C alkylene group; Xs are each independently a 1-18C alkylene group or an arylene group; and m and n are each an integer of 1-20) and (B) 1-90 pts.wt. inorganic particle. The film-formed material has a film formed using the polyimide resin composition. COPYRIGHT: (C)2005,JPO&NCIPI
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