发明名称 Method and system for reducing aggregate impedance discontinuity between expansion connectors
摘要 A method and system are provided for reducing impedance discontinuities which occur when two expansion connectors are located very close to one another on a bus in an information handling system. An interconnect is situated between the two expansion connectors and exhibits an impedance which is selected to be sufficiently low to compensate for the amount by which the impedance of the expansion bus connectors exceeds the impedance of the expansion bus connected thereto.
申请公布号 US2005130501(A1) 申请公布日期 2005.06.16
申请号 US20050048326 申请日期 2005.02.01
申请人 DELL PRODUCTS L.P. 发明人 TIMMINS IAN;LEINS MICHAEL;HAYES STUART;BASSMAN ROBERT
分类号 G06F13/00;G06F13/40;H01R24/00;H03K17/16;H03K19/003;(IPC1-7):H01R24/00 主分类号 G06F13/00
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