| 摘要 |
956,934. Semi-conductor devices. S. RUBEN. Jan. 24, 1962 [Feb. 20, 1961], No. 2599/62. Heading H1K. An insulation coated unit consisting of a semiconductor body and associated electrodes is encapsulated and integrated with a mounting stud by a mass of fusible metal cast around the unit and stud. Typically a diode consisting of a PN junction silicon wafer soldered between metal plates from which extend insulated copper leads 33, 34 (Fig. 3) is first coated with a hardenable epoxy resin filled with mica, or preferably powdered titania. After heat curing the coating the unit 38 and threaded copper stud 50 are placed in a shaped mould 44 and a 63: 37 tinlead alloy cast about them to form an axially finned heat sink. Contraction of the metal on coating ensures good thermal contact between the stud, diode and metal mass. An alternative casting metal is cadmium-tin. Germanium rectifier diodes and tunnel diodes and transistors may be similarly encapsulated. Specification 936,886 is referred to. |
