| 摘要 |
A method of analyzing electronic components and the analyzing device, with which the designing time can be made shorter and the cost reduction can be implemented. In analyzing an electronic component comprising bump electrode, such as a solder bump, an Au bump or BGA, a 3-D model electronic data containing information on the shape of electronic component is provided at step S1. Next at step S2, curved line and curved surface forming the 3-D model is replaced with a 3-D model approximated using polygons. At step S3, a finite element model is provided by converting the polygon-approximated 3-D model. And then at step S4, numerical simulation such as a finite element analysis which uses the finite element model made available at the step 3 is executed. Finally at step S5, the analysis results are displayed for evaluation. <IMAGE>
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