首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Encapsulation of a TCPA trusted platform module functionality within a server management coprocessor subsystem
摘要
申请公布号
GB0509319(D0)
申请公布日期
2005.06.15
申请号
GB20050009319
申请日期
2003.10.07
申请人
INTEL CORPORATION
发明人
分类号
G06F1/00;G06F12/14;G06F21/00
主分类号
G06F1/00
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Connecting pieces for weapon rails
Dual-action breakaway gate safety system
Microfluidic devices and related methods and systems
Device for compacting fiber flocks
Hibiscus plant named‘Dave Fleming’
Methods for normalizing strain in a semiconductor device
Semiconductor device with compressive and tensile stresses
Electric connector assembly
High capacity scheduler
Plasma display apparatus having enhanced discharge stability and driving thereof
Carbon black with large primary particle size as reheat additive for polyester and polypropylene resins
Wheel cover assembly with stationary and rotating covers
Chew toy with fabric or fabric layering
Techniques for wirelessly controlling push-to-talk operation of half-duplex wireless device
Method and apparatus to perform reactive jamming while simultaneously avoiding friendly pseudo-random frequency hopping communications
Thin film transistor array substrate having particular pixel electrode and patterned upper electrode
Distributed stand-off ID verification compatible with multiple face recognition systems (FRS)
Car antitheft system
Derivatives of benzimidazole and imidazo-pyridine and their use as medicaments
Semiconductor ferroelectric device, manufacturing method for the same, and electronic device