| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-frequency multilayered wiring board provided with a transmission path composed of a dielectric wave guide in which a dielectric is encompassed by a conductor layer, and its manufacturing method. SOLUTION: A slit 11 of width L1 is formed into a first insulating layer 10 composed of a dielectric and sidewall conductor layers 12, 13 are formed in a sidewall in the slit 11. Next, a first conductor layer 15 of a width L2 which is wider than a width L1 is formed at a position where the slit 11 is totally closed on an upper face of a second insulating layer 14 composed of a dielectric and the second insulating layer 14 is laminated so as to close the slit 11 by a first conductor layer 15 on a lower face of the first insulating layer 10. The slip 11 is filled with a dielectric 16, and a second conductor layer 17 composed of a width L3 wider than a width L1 is formed on an exposed face of the dielectric 16 in the slit, to thereby produce a high-frequency multilayered wiring board provided with a dielectric wave guide comprising the first conductor layer 15, the sidewall conductor layers 12, 13, the dielectric 16, and the conductor layer 17. |
