发明名称 METHOD FOR MANUFACTURING COMPOUND SEMICONDUCTOR WAFER AND COMPOUND SEMICONDUCTOR DEVICE
摘要 A method for producing a compound semiconductor wafer used for production of HBT by vapor growth of a sub-collector layer, a collector layer, a base layer and an emitter layer in this turn on a compound semiconductor substrate using MOCVD method wherein the base layer is grown as a p-type compound semiconductor thin film layer containing at least one of Ga, Al and In as a Group III element and As as a Group V element under such growth conditions that the growth rate gives a growth determined by a Group V gas flow rate-feed. <IMAGE>
申请公布号 EP1542288(A1) 申请公布日期 2005.06.15
申请号 EP20030784504 申请日期 2003.08.01
申请人 SUMITOMO CHEMICAL COMPANY, LIMITED;SUMIKA EPI SOLUTION COMPANY, LTD. 发明人 YAMADA, HISASHI;FUKUHARA, NOBORU
分类号 H01L21/205;H01L21/331;H01L29/737;(IPC1-7):H01L29/737 主分类号 H01L21/205
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