发明名称 Semiconductor device with vertical transistor formed in a silicon-on-insulator substrate
摘要 A semiconductor device has an element substrate including a semiconductor layer of a first conductivity type being formed over a semiconductor substrate with a dielectric film interposed therebetween. A groove is formed in the element substrate with a depth extending from a top surface of the semiconductor layer into the dielectric film, the groove having a width-increased groove portion in the dielectric film as to expose a bottom surface of the semiconductor layer. An impurity diffusion source is buried in the width-increased groove portion to be contacted with the bottom surface. A transistor is formed to have a first diffusion layer being formed through impurity diffusion from the impurity diffusion source to the bottom surface of the semiconductor layer, a second diffusion layer formed through impurity diffusion to the top surface of the semiconductor layer, and a gate electrode formed at a side face of the groove over the impurity diffusion source with a gate insulation film between the side face and the gate electrode.
申请公布号 US6906372(B2) 申请公布日期 2005.06.14
申请号 US20010993967 申请日期 2001.11.27
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 YAMADA TAKASHI;KAJIYAMA TAKESHI
分类号 H01L21/8242;H01L27/108;H01L27/12;(IPC1-7):H01L27/108;H01L29/76;H01L29/94;H01L31/119 主分类号 H01L21/8242
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