发明名称 Method and apparatus for drying substrate
摘要 The substrate drying apparatus has a substrate processing vessel 1 , a substrate supporting section for supporting plural substrates 2 in a standing condition and lined up condition in the interior of the substrate processing vessel 1 , fluid reservoir section 3 for drying provided at an upward predetermined position of the substrate processing vessel 1 , a first inert gas supplying section 4 for blowing inert gas against the drying fluid 6 pooled in the fluid reservoir section 3 for drying so as to generate droplet of the drying fluid, and for guiding the droplet towards the center of the substrate processing vessel 1 , and a second inert gas supplying section 5 for supplying inert gas vertically and downwardly so as to supply the generated droplet of the drying fluid towards the substrates 2 , consequently safety is improved without providing special safety device, and sufficient amount of drying fluid is supplied to the dipping boundary face of the substrate and the cleaning liquid.
申请公布号 US6904702(B2) 申请公布日期 2005.06.14
申请号 US20030438002 申请日期 2003.05.15
申请人 DAIKIN INDUSTRIES, LTD. 发明人 SOTOJIMA TAKAZO;MAEDA NORIO
分类号 B08B3/04;H01L21/00;H01L21/304;(IPC1-7):F26B3/00 主分类号 B08B3/04
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