发明名称 |
Multiple dice package |
摘要 |
A semiconductor device for multiple dice is provided that reduces insertion loss and return loss. In an example embodiment, the semiconductor device comprises: a package 20 comprising a mount surface 14 to which dice 61 and 65 are mounted, and a bond pad surface 25 defining at least a first die area 27 and a second die area 29, wherein the second die area 29 is different in form from the first die area 27. |
申请公布号 |
US6906406(B2) |
申请公布日期 |
2005.06.14 |
申请号 |
US20020324533 |
申请日期 |
2002.12.19 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
HWANG LIH-TYNG;DRYE JAMES E.;KUO SHUN MEEN |
分类号 |
H01L23/057;H01L23/538;H01L25/065;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/057 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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