| 摘要 |
An inkjet printhead with a substrate supporting an array of ink ejection nozzles. Each ink ejection nozzle having a chamber, a thermal bend actuator and associated drive circuitry. The chamber stores ink to be ejected, and has an ink inlet and a nozzle aperture. The thermal bend actuator ejects ink from the chamber through the nozzle aperture. The drive circuitry operates the thermal bend actuator. When viewed from a direction normal to the substrate, the nozzle aperture at least partially overlies the ink inlet and the thermal bend actuator at least partially overlies the drive circuitry. By arranging the nozzle structures such that there is vertical stacking of the components where possible, the entire nozzle arrangement occupies a small printhead surface area. Therefore, more nozzles can be manufactured on each wafer and fabrication costs are reduced. Using a thermal bend actuator generates less heat than a bubble forming heater element which allows it to closely overlay the drive circuitry. Likewise, feeding ink into the chamber from directly beneath the nozzle aperture removes the need for ink feed channels adjacent each of the ink ejection nozzles.
|
