| 摘要 |
A printed wiring board, particularly, an interposer 20 for a chip scale package, comprising an outer insulator layer 22 having outer electrodes 31, a conductor layer 21, and an inner insulator layer 23 having inner electrodes 27, the electrodes 31 and/or 27 having been formed by electroplating using, as a negative electrode, a metal plate 32 that has been provided on the outer insulator layer 22 and removed after the electroplating. Having no plating leads, the printed wiring board has the electrodes in an orderly array at a fine pitch and a high density.
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