发明名称 Technique for connector to printed circuit board decoupling to eliminate flexure
摘要 An electronic assembly and/or a mold is constructed to reduce deflection and resultant damage to components and/or an associated printed circuit board of the electronic assembly when the electronic assembly is overmolded.
申请公布号 US6905349(B1) 申请公布日期 2005.06.14
申请号 US20040784350 申请日期 2004.02.23
申请人 DELPHI TECHNOLOGIES, INC. 发明人 BRANDENBURG SCOTT D.;LAUDICK DAVID A.;DEGENKOLB THOMAS A.;MANDEL LARRY M;PARKER RICHARD D.
分类号 H01R12/00;H05K1/02;H05K3/28;(IPC1-7):H01R12/00 主分类号 H01R12/00
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