发明名称 |
DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE |
摘要 |
An object is to provide a dielectric layer of a double-sided copper clad laminate, for use in formation of a built-in capacitor layer, which can be formed in an optional thickness without using a skeletal material and is provided with a high strength. For the purpose of achieving the object, "a dielectric filler containing resin for use in formation of the built-in capacitor layer of a printed wiring board obtained by mixing a binder resin comprising 20 to 80 parts by weight of epoxy resin (inclusive of a curing agent), 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer, and a curing accelerator added in an appropriate amount according to need; and a dielectric filler which is a nearly spherical dielectric powder having perovskite structure which is 0.1 to 1.0 mum in the average particle size D<SUB>IA</SUB>, 0.2 to 2.0 mum in the weight cumulative particle size D<SUB>50 </SUB>based on the laser diffraction scattering particle size distribution measurement method, and 4.5 or less in the coagulation degree represented by D<SUB>50</SUB>/D<SUB>IA </SUB>where the weight cumulative particle size D<SUB>50 </SUB>and the average particle size D<SUB>IA </SUB>obtained by the image analysis"; and the like are used.
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申请公布号 |
US6905757(B2) |
申请公布日期 |
2005.06.14 |
申请号 |
US20030478419 |
申请日期 |
2003.11.21 |
申请人 |
MITSUI MINING & SMELTING CO., LTD. |
发明人 |
MATSUSHIMA TOSHIFUMI;MIWA HIDEAKI;ICHIRYU AKIRA;YAMAZAKI KAZUHIRO;SATO TETSURO;KUWAKO FUJIO |
分类号 |
B32B15/08;B32B27/18;B32B27/34;B32B27/38;C08K7/00;C08K7/16;C08L63/00;C08L77/00;C08L77/10;H01L23/12;H05K1/16;H05K3/38;(IPC1-7):B32B3/00 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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