发明名称 RESIN-COATED METAL PLATE FOR USE IN PERFORATING PRINTED-WIRING BOARD
摘要 <p>The present invention provides a resin-coated metal plate suitable as a cover plate for use in perforating a printed-wiring board with a drill, capable of effectively preventing the heat generation of drill bits and the scattering of chips while sufficiently performing lubrication and discharging the chips, to highly efficiently form a high-quality perforated-hole with excellent smoothness of the inner wall thereof while reducing the risk of breakage of the drill and eliminating any surface tackiness to achieve excellent operating performance and storage stability. The resin-coated metal plate of the present invention comprising a metal base plate, and a film made of a thermoplastic resin and formed on at least one of the opposite surfaces of said metal base plate to cover thereover, said thermoplastic resin being substantially water-insoluble, wherein said thermoplastic resin has: a melting peak temperature measured according to JIS K7121 ranging from 60° C. to 120° C.; a melt viscosity ranging from 1×103 P to 1×104 P under a shear rate of 200 mm/sec, and from 5×102 P to 5×103 P under a shear rate of 3000 mm/sec, in the state when said thermoplastic resin is molten at 150° C.; and a durometer D hardness measured according to JIS K7215 ranging from 20 to 45.</p>
申请公布号 KR20050056149(A) 申请公布日期 2005.06.14
申请号 KR20040103091 申请日期 2004.12.08
申请人 KABUSHIKI KAISHA KOBE SEIKO SHO;SUN ALUMINIUM INDUSTRIES, LTD. 发明人 YOSHIKAWA EIICHIRO;FUJIWARA NAOYA;OKAMURA YASUHIRO
分类号 B23B45/14;B23B49/00;B32B15/08;H05K3/00;(IPC1-7):B32B15/08 主分类号 B23B45/14
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