发明名称 |
TAPE CIRCUIT SUBSTRATE, SEMICONDUCTOR CHIP PACKAGE USING THEREOF, AND DISPLAY PANEL ASSEMBLY USING THEREOF |
摘要 |
A tape circuit substrate includes a base film with first wiring and second wiring disposed on the base film. The first wiring extends into a chip mount portion through a first side and bends within the chip mount portion toward a second side. The second wiring extends into the chip mount portion through a third side and bends within the chip mount portion toward the second side. The first, second, and third sides are different sides of the chip mount portion. Thus, size and in turn cost of the base film are minimized by arranging wirings within the chip mount portion for further miniaturization of electronic devices, such as a display panel assembly, using the tape circuit substrate. |
申请公布号 |
KR20050054022(A) |
申请公布日期 |
2005.06.10 |
申请号 |
KR20030087297 |
申请日期 |
2003.12.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK, SANG HO;KANG, SA YOON;LEE, SI HOON |
分类号 |
H01L21/60;G02F1/13;G02F1/1345;G09F9/00;G09G3/00;H01L21/56;H01L21/58;H01L23/12;H01L23/48;H01L23/498;H05K1/14;H05K3/36;(IPC1-7):G02F1/134 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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