| 发明名称 |
Die attachment with reduced adhesive bleed-out. |
| 摘要 |
An organic chip carrier having metallic circuitry and wire bond pads thereon is bonded to an integrated circuit die by a photocurable adhesive and is electrically connected therewith by wire bonding to the wire bond pads. |
| 申请公布号 |
HK1025183(A1) |
申请公布日期 |
2005.06.10 |
| 申请号 |
HK20000104382 |
申请日期 |
2000.07.18 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BERND KARL APPELT;GARY ALAN JOHANSSON;PAPATHOMAS, KONSTANTINOS, I. |
| 分类号 |
H01L21/60;H01L21/52;H01L21/58;H01L21/607 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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