发明名称 |
CMOS WELL STRUCTURE AND FORMING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a CMOS well structure and a method for forming it. SOLUTION: A method for forming a CMOS well structure comprises a process of forming multiple first conductivity type wells over a substrate. The multiple first conductivity type wells are formed in respective openings in a first mask. A cap is formed over each of the first conductivity type wells, and the first mask is removed. Sidewall spacers are formed on the sidewalls of each of the first conductivity type wells. Multiple second conductivity type wells are formed in respective areas between the first conductivity type wells. Multiple shallow trench isolations are formed between the first conductivity type wells and the second conductivity type wells. The multiple first conductivity type wells are formed in a first selective epitaxial growth process, and the multiple second conductivity type wells are formed in a second selective epitaxial growth process. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005150731(A) |
申请公布日期 |
2005.06.09 |
申请号 |
JP20040328193 |
申请日期 |
2004.11.11 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
JOSHI RAJIV V;HSU LOUIS C;HOOK TERENCE B;RAUSCH WERNER |
分类号 |
H01L21/76;H01L21/8238;H01L27/08;H01L27/092;H01L29/78;(IPC1-7):H01L21/76;H01L21/823 |
主分类号 |
H01L21/76 |
代理机构 |
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代理人 |
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主权项 |
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