| 摘要 |
PROBLEM TO BE SOLVED: To provide an addition reaction-curable organopolysiloxane composition excellent in storage stability of the composition and giving a cured product improved in surface smoothness. SOLUTION: The organopolysiloxane composition for coating semiconductor devices comprises (A) a diorganopolysiloxane such as dimethylpolysiloxane having at least two alkenyl groups in a molecule, (B) an organohydrogenpolysiloxane such as methylhydrogenpolysiloxane, (C) a platinum group metal catalyst, (D) an acetylene alcohol reaction inhibitor and (E) alkynyloxy-containing organopolysiloxane as the main components. COPYRIGHT: (C)2005,JPO&NCIPI
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