Methods for manufacturing semiconductor device

摘要

Methods of forming a silicide layer with small grain boundary size on a source/drain region of semiconductor device are disclosed. A disclosed method comprises forming a gate insulating layer and a gate electrode on an active region of a semiconductor substrate; forming spacers on the sidewalls of the gate electrode; implanting impurity ions for a source/drain region at a high concentration by using the gate electrode and the spacers as an ion implantation mask; depositing an interlayer dielectric layer over the semiconductor substrate including the gate electrode and the spacers; forming contact holes through the interlayer dielectric layer; depositing a barrier metal layer for silicide layers along the top surface of the interlayer dielectric layer and along the sidewalls and the bottoms of the contact holes; and performing a thermal treatment process to complete a source/drain region in the active region and form silicide layers on the source/drain region and the gate electrode.