LEAD FRAME, METHOD OF MANUFACTURING SAME, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, AND SEMICONDUCTOR DEVICE USING FRAME

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing lead frame by which a lead frame having the removal stopping structure of a chip supporting section can be manufactured inexpensively and the bottom surface of the chip supporting section can surely be caused to expose from a sealing resin.

SOLUTION: The lead frame 10 has a supporter 1 which supports a semiconductor chip and a lead 2. The supporter 1 is coupled with a frame 5 through a hanging lead 4. In the edges of the supporter 1, coming-out stoppers 31 formed by performing a crushing-in process from the top surface are formed in a state where the coming-out stoppers 31 are protruded in the lateral direction. The hanging lead 4 has an upset portion 41 positioned higher than the bottom surface of the lead 2 and a connector 42 which connects the upset portion 41 to the supporter 1, and holds the supporter 1 in a state where the supporter 1 is down-set lower than the lead 2.

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