发明名称 METHOD OF MANUFACTURING FLASH MEMORY ELEMENT
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing flash memory element by which the reliability of a flash memory element can be improved by securing the stability of a process by improving the EFH differences induced among a cell region, a high-voltage transistor region, and a low-voltage transistor region by the projecting sections of the field oxide films of the regions. SOLUTION: The method of manufacturing the flash memory element includes a step of providing a semiconductor substrate on which the cell region, high-voltage transistor region, and low-voltage transistor region are defined; a step of forming high-EFH field oxide films respectively in the cell region and low-voltage transistor region of the semiconductor substrate, and a low-EFH field oxide film in the high-voltage transistor region of the semiconductor substrate based on the topological differences among the gate oxide films formed in the regions; and a step of making the EFHs of the field oxide films formed in the regions equal or similar to each other by etching the high-EFH field oxide films by fixed thicknesses in a step of recessing the field oxide films. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005150678(A) 申请公布日期 2005.06.09
申请号 JP20040177973 申请日期 2004.06.16
申请人 HYNIX SEMICONDUCTOR INC 发明人 LEE SEUNG-CHEOL;PARK SOUKU
分类号 H01L21/76;H01L21/336;H01L21/8234;H01L21/8247;H01L27/08;H01L27/088;H01L27/10;H01L27/105;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/824;H01L21/823 主分类号 H01L21/76
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