| 摘要 |
PROBLEM TO BE SOLVED: To provide electronic equipment whose heat-radiating efficiency is high, by removing heat transfer loss due to contact thermal resistance. SOLUTION: This electronic equipment is provided with a plurality of electrical component mounting modules 3, formed integrally with heat sinks 7 and a case body 2, on which the plurality of modules 3 are mounted. Seals 8, for adhesively connecting the heatsinks 7 of the adjacent modules 3, are formed in the periphery of the heat sinks 7. The modules 3 are mounted via connectors 6 on the case body 2 so that the heat sinks 7 can be connected via the seals 8, and ducts 11 sealed in the case body 2 are formed of a series of heat sinks 7. Then, the electrical component mounting modules are integrally formed with the heat sinks so that it is possible to prevent the contacts of the case body with the electrical component mounting modules in the middle of a heat transfer path. COPYRIGHT: (C)2005,JPO&NCIPI
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