| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for manufacturing semiconductor device by which the reliability of a semiconductor device can be improved. SOLUTION: The method includes a step (a) of providing a reinforcing member on one surface of a wiring board which has a first region for mounting a semiconductor chip, a second region surrounding the first region, and terminals extended from the first region to the second region and provided on the other surface, in a state where the reinforming member overlaps the terminals and partially protruded to the second region from the first region. The method also includes a step (b) of continuously cutting the reinforcing member from the inside to the outside along the boundary between the first and second regions by punching the member from the surface side on the wiring board, and a step (c) of cutting the terminals along the boundary between the first and second region by punching the terminals from the surface side of the reinforcing member on the wiring board. COPYRIGHT: (C)2005,JPO&NCIPI
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