发明名称 LOW ADSORPTION SEALANT SUBSTRATE AND LOW ADSORPTION PACKAGE USING THE SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a low adsorption sealant substrate which prevents the reduction with the passage of time of a pharmaceutically effective component and a perfume component contained in the content such as food, drink, toiletries, or medical supplies by being adsorbed to a packaging material and is excellent in gas-barrier properties, film making aptitude, bag making aptitude, sealant strength, and a low adsorption package using the substrate. SOLUTION: The low adsorption sealant substrate constitutes the low adsorption package. In the low adsorption sealant substrate and the low adsorption package using the substrate, an inorganic vapor deposition thin film layer is laminated on a fusion-bondable thermoplastic resin layer. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005144879(A) 申请公布日期 2005.06.09
申请号 JP20030386271 申请日期 2003.11.17
申请人 TOPPAN PRINTING CO LTD 发明人 KAGAWA SACHIKO;HACHIFUSA KAZUYA
分类号 B65D81/24;B32B9/00;B65D65/40;(IPC1-7):B32B9/00 主分类号 B65D81/24
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