| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin layer forming device capable of forming the resin layer closely bonded to a substrate, and an embossing device capable of forming an embossed pattern to the resin layer with high precision. SOLUTION: This embossing device 30 is mainly composed of a resin layer forming device 31 and an embossing part 21. The resin layer forming device is equipped with a corona discharge device (dischargfe means) 32, a partition wall 43, a resin feeder (resin supply means) 14, a molding blade (flattening means) 45 and a feed roller 46. A substrate 17, on which the resin layer must be formed, is introduced into the embossing device 30 by the feed roller 46 and the like. The corona discharge device 32 is constituted so as to apply a high voltgage current of high frequency to one set of electrodes 32a to excite electron energy to generate corona discharge toward the substrate 17. COPYRIGHT: (C)2005,JPO&NCIPI
|
