| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve problems that the manufacturing process is completed in the case of incorporating electronic components in a printed wiring board, micromachining is required and weight reduction is difficult, the space for the wiring region is pressed and wiring connection of ground and power supply becomes a weak point because the space in the board is required for incorporating the components. <P>SOLUTION: A sheet component embedded with a resistor, or a capacitor, or an inductor, or a temperature sensor is inserted between an IC and a printed wiring board at a place nearly coincident with the pad position of the IC. Since the signal integrity can be ensured without using a resistive component on the way of wiring on the printed circuit board, the occupied area by the component can be reduced. Further, since a resistive component or an inductive component can be connected at a position close to an output terminal of the IC, spurious radiation can be prevented. Moreover, since no swollen part is caused to bus wiring for mounting the resistive component or the inductive component, the region of the bus wiring shares only the width of the bus wiring and a degree of the circuit design can considerably be enhanced. Further, problems of ground bounce and EMI can be improved. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
