| 摘要 |
PROBLEM TO BE SOLVED: To reduce the sensor size in the direction parallel to an installation surface of a sensor chip in a pressure sensor having the sensor chip and a processing circuit board for processing a sensor signal. SOLUTION: The pressure sensor S1 comprises: a stem 10 which is hollow tubular in shape, has a diaphragm 11 deformable by pressure on a part of the outer surface, and an opening 12 for introducing pressure into the hollow section; a sensor chip 20 which is placed on the diaphragm 11 and outputs an electrical signal according to the deformation of the diaphragm 11; and the processing circuit board 30 which is placed around the sensor chip 20 and processes the electrical signal from the sensor chip 20. The processing circuit board 30 is placed so that a substrate surface of the processing circuit board 30 is positioned perpendicular to the installation surface 10a in the stem 10 for the sensor chip 20. COPYRIGHT: (C)2005,JPO&NCIPI
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