发明名称 |
LIQUID DRAINING APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To remove a remaining liquid as much as possible from the surface of a substrate without drying the surface, make even the thickness of the coating remaining after the removal, and suppress liquid scattering even in the case a large scale substrate is transported at a high speed, with respect to a liquid draining apparatus for removing a treatment liquid remaining on the surface of a substrate. SOLUTION: Linear nozzles 30 and 40 for removing a liquid by air knife in the full width of a substrate 10 are arranged in two-steps in the transport direction of the substrate 10. The linear nozzles 30 and 40 are slanted at an angleθ1 of 5 to 30°to the side against the transport direction of the substrate 10. The distance D of the linear nozzles 30 and 40 is set to be 50 to 300 mm. The amount of air discharged from the linear nozzle 40 is set to be not more than that of the linear nozzle 30. The slanting angle to the vertical line of the air knife is set to be 25-30°for the linear nozzle 30 and 20-25°for the linear nozzle 40. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005144325(A) |
申请公布日期 |
2005.06.09 |
申请号 |
JP20030385130 |
申请日期 |
2003.11.14 |
申请人 |
SUMITOMO PRECISION PROD CO LTD |
发明人 |
INOUE KOICHI;KONDO TOMOKI;FUJINE OSAMU |
分类号 |
B08B5/02;H01L21/02;H01L21/304;H01L21/306;(IPC1-7):B08B5/02 |
主分类号 |
B08B5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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