发明名称 MANUFACTURING METHOD OF TAPE CARRIER FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a technology of uniformizing an etching state in the middle and the surrounding part of a tape by carrying a flexible board at etching without causing deflection corresponding to the flexibility of the flexible board, and uniformly and efficiently spraying etching liquid to the flexible board so as to etch the flexible board without leaving fatigued etching liquid. SOLUTION: In the manufacturing method of a tape carrier for a semiconductor device including steps of spraying the etching liquid 4 to the belt like flexible board carried in a lateral direction, and etching a conductor layer to form a wiring pattern, the flexible board is etched while placing a flat plate 7 on the surface of the flexible board at the other side of an etching liquid sprayed side or horizontally supporting the flexible board with a roll 8 or the like. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005150488(A) 申请公布日期 2005.06.09
申请号 JP20030387367 申请日期 2003.11.18
申请人 HITACHI CABLE LTD 发明人 SUGIMOTO HIROSHI;YOSHIMATSU YASUTAKA;ENDO HIROHISA;FUJIMOTO KENICHIRO
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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