| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a land grid array package which can suppress short-circuiting or disconnection. <P>SOLUTION: In the land grid array package, an element-side ground electrode 6, a substrate-side ground electrode 9, an element-side peripheral electrode 7, and a substrate-side peripheral electrode 10 are soldered with eutectic solder 16. A degassing through-hole 15 passed through a mounting board 3 is formed in a soldering region 18 of the element-side ground electrode 6. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
