| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing wiring board by which the etching margins caused by a roughening process performed for roughening the surfaces of wiring pattern layers formed at fine pitches can be made smaller and uniform. SOLUTION: The method of manufacturing a wiring board K includes a step of forming thin copper layers 20 and 21 by electroless copper plating on the surfaces of insulating resin layers 16 and 17, a step of forming resists 22a, 22b, 23a, 23b on the thin copper layers 20 and 21 in prescribed patterns, and a step of forming the wiring pattern layers 28, 28a, 29, and 29a in the gaps 24 and 25 among the resists 22a, 22b, 23a, and 23b, or the like. The method also includes a step of removing the resists 22a, 22b, 23a, and 23b and the thin copper layers 20 and 21 immediately under the resists 22a, 22b, 23a, and 23b, a step of etching the surfaces of the wiring pattern layers 28 and 29, etc., by a thickness of≤1μm, and a step of forming new insulating resin layers 30 and 31 above the insulating resin layers 16 and 17, etched wiring pattern layers 28 and 29, etc. COPYRIGHT: (C)2005,JPO&NCIPI |
