发明名称 |
METHOD OF FORMING CONDUCTIVE ROUGH SURFACE AND FORMING MATERIAL FOR CONDUCTIVE ROUGH SURFACE |
摘要 |
PROBLEM TO BE SOLVED: To provide an anti-corrosion surface treatment technique in which adhesiveness and sacrificial anti-corrosion action are highly combined. SOLUTION: A conductive rough surface coated film comprising a rough surface forming material is formed on a metal material 1 by using the rough surface forming material formed by dispersing 90-700 vol.% of conductive particles 2a with a particle size of not larger than 500μm to resin, with a viscosity of 400-1200mPa s(±200mPa s)measured in conformity to JIS K 6833, and with a surface drying (ballotini method) of 2-30 minutes measured in conformity to JIS K 5600-3-2, and by coating it by spraying onto the metal material 1 in conditions of a spraying pressure of 0.3-1.0 MPa and a spraying distance of 50-400mm. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005144446(A) |
申请公布日期 |
2005.06.09 |
申请号 |
JP20040308767 |
申请日期 |
2004.10.22 |
申请人 |
ALPHA KOGYO KK;KBS GIJUTSU KENKYUSHO:KK |
发明人 |
HAMAKI HARUO;OIGAWA YUKIHIKO |
分类号 |
B05D5/12;B05D1/02;C23C24/04;(IPC1-7):B05D5/12 |
主分类号 |
B05D5/12 |
代理机构 |
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地址 |
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