发明名称 FLAT PLATE HEAT TRANSFER DEVICE
摘要 Disclosed is a flat plate heat transfer device, which includes a thermally conductive flat case installed between a heat source and a heat emitting unit and containing a working fluid evaporated with absorbing heat from the heat source and condensed with emitting heat to the heat emitting unit; and a mesh layer aggregate installed in the flat case and having a structure that a fine mesh layer for providing a flowing path of liquid and a coarse mesh layer for providing a flowing path of liquid and a dispersion path of vapor simultaneously are laminated. On occasions, the coarse and the fine mesh layers are alternately laminated repeatedly, and the fine mesh layer is replaced with a wick structure. The coarse mesh layer is preferably a screen mesh layer with wire diameter of 0.2 mm ~ 0.4 mm and mesh number of 10 ~ 20. This device improves heat transfer performance.
申请公布号 WO2005053371(A1) 申请公布日期 2005.06.09
申请号 WO2004KR03042 申请日期 2004.11.24
申请人 LS CABLE LTD.;LEE, YONG-DUCK;OH, MIN-JUNG;KIM, HYUN-TAE;JANG, SUNG-WOOK 发明人 LEE, YONG-DUCK;OH, MIN-JUNG;KIM, HYUN-TAE;JANG, SUNG-WOOK
分类号 H01L23/427;H01L23/467;H05K7/20 主分类号 H01L23/427
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