摘要 |
A Hop-FED structure has emitter areas (301, 302) on a substrate (300), and a hop-plate (303) disposed over the substrate (300) and emitter areas (301, 302) with a surface of the hop-plate (303) opposing the substrate (300) and emitter areas (301, 302). An electrically conductive layer (401) is formed on the surface of the hopplate (303), to dissipate charge build-up. |