| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an integrated circuit structure in which an electromagnetic shield and a wiring structure are matched to a substrate, and to provide a method of manufacturing the integrated circuit structure. <P>SOLUTION: An electromagnetic shield housing is formed by connecting electromagnetic shield patterns, a plug and a bonding pin which is inner-pierced to the substrate. Thereby, an integrated circuit device can be further protected from an electromagnetic interference generated by an integrated circuit itself or outside environments. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
