| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for electric power which is small-sized and has high reliability. <P>SOLUTION: The semiconductor device 100 for electric power which has a plurality of leads 1 projected from mold resin 6 includes a 1st lead including a 1st die pad part, power chips 21 and 22 which are mounted on the top surface of the 1st die pad part, an insulating sheet 7 which is fitted to the reverse surface of the 1st die pad part and has larger heat conductivity than the mold resin 6, a 2nd lead including a 2nd die pad part, a control chip 3 which is mounted on the 2nd die pad part, a wire 4 which consists principally of gold connecting the power chips 21 and 22 and control chip 3, and the mold resin 6 in which the control chip 3 and power chips 21 and 22 are buried so that ends of the 1st lead and 2nd lead protrude respectively. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
