SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To solve a problem of a semiconductor integrated circuit device with multiple power supplies that many electrostatic protection elements are required among the power supplies to hold the reliability thereof and a chip area is increased. SOLUTION: The semiconductor integrated circuit device comprises, on a semiconductor substrate, a semiconductor integrated circuit chip including a plurality of circuit systems which are mounted respectively in separation and driven with different power supply systems and at least an electrostatic protection circuit, and an external connecting terminal 5 connected to the circuit system of the semiconductor integrated circuit chip via a wiring member 4 having at least single layer of the wiring layer. These chip and terminal are connected in common via a conductive plain 43 provided to the wiring member so that the power supply line of the circuit system and the grounding line of the semiconductor integrated circuit chip 1 are respectively connected via the electrostatic protection circuit 2. COPYRIGHT: (C)2005,JPO&NCIPI