摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device narrowing the pad pitches of a semiconductor element such as a TFT, enhancing certainty of conduction to the semiconductor element, and preventing the semiconductor from being damaged, and also to provide a manufacturing method of the semiconductor device, an EL device, and a manufacturing method of the EL device. SOLUTION: In this semiconductor device, the element 13 is directly connected to a mounting substrate 10 by a single film comprising a conductive material 11. COPYRIGHT: (C)2005,JPO&NCIPI |